C - Black Silicon Carbide


C is a black silicon carbide lapping powder commonly known as Carborundum. Like GC, C is produced by reacting silica and coke in an electric furnace at a temperature greater than 2000° C. This produces the following qualities:

  • An α‑type silicon carbide crystal configuration
  • Stable cutting edges
  • Ideal particle-size distribution

C is excellent for abrasive machining and produces superior lapping on a work surface. C is thus ideal as a material for precision-lapping polishing cloths and papers as well as precision grindstones.

Additional uses of C include:

  • Precision lapping of:
    • Cast iron
    • Brass
    • Copper
    • Aluminum
    • Stones
    • Glass for photomasks
    • Precision honing and dicing used in products such as semiconductor crystals

Standard Specifications for Particle Size

Particle Size Particle Distribution (µm)
Maximum Particle Size Particle Size at d03 Particle Size at d50 Particle Size at d94
# 240 ≤ 127 ≤ 103 58.6 ± 3.0 ≥ 40.0
# 280 ≤ 112 ≤ 87.0 49.4 ± 3.0 ≥ 33.0
# 320 ≤ 98.0 ≤ 74.0 41.1 ± 2.5 ≥ 27.0
# 360 ≤ 86.0 ≤ 66.0 36.1 ± 2.0 ≥ 23.0
# 400 ≤ 75.0 ≤ 58.0 30.9 ± 2.0 ≥ 20.0
# 500 ≤ 63.0 ≤ 50.0 26.4 ± 2.0 ≥ 16.0
# 600 ≤ 53.0 ≤ 43.0 21.1 ± 1.5 ≥ 13.0
# 700 ≤ 45.0 ≤ 37.0 17.9 ± 1.3 ≥ 11.0
# 800 ≤ 38.0 ≤ 31.0 14.7 ± 1.0 ≥ 9.00
# 1000 ≤ 32.0 ≤ 27.0 11.9 ± 1.0 ≥ 7.00
# 1200 ≤ 27.0 ≤ 23.0 9.90 ± 0.80 ≥ 5.50
# 1500 ≤ 23.0 ≤ 20.0 8.40 ± 0.60 ≥ 4.50
# 2000 ≤ 19.0 ≤ 17.0 6.90 ± 0.60 ≥ 4.00
# 2500 ≤ 16.0 ≤ 14.0 5.60 ± 0.50 ≥ 3.00
# 3000 ≤ 13.0 ≤ 11.0 4.00 ± 0.50 ≥ 2.00
# 4000 ≤ 11.0 ≤ 8.00 3.00 ± 0.40 ≥ 1.30

Notes:
Particle size is measured by Electrical sensing zone methods up to size #4000.

Quality Standards

Particle Size Specific Gravity Chemical Composition (%)
SiC C.F Fe.s
#240 ~ #4000 ≥ 3.16 ≥ 94.0 ≤ 1.50 ≤ 0.50

 

Product Stats:

Category:
Lapping & Grinding

Application:
precision lapping of brass, precision lapping of cast iron, precision lapping of aluminum, finishing precision grind-stones, grind-stones, precision lapping, precision lapping polishing papers, abrasive machining, precision lapping polishing cloths, lapping, precision lapping of stones, precision lapping of glass for photomasks, Hardened Glass Lens Lapping, precision honing and dicing process, Crystal Lapping, Silicon Ingot Wire-Saw Materials, Super Hard Metals Lapping, Silicon Wafer Precision Blasting, Super Finishing PVA Grindstone, Super Finishing Vitrified Grindstone, precision lapping of copper, Precision Coated Polishing Cloth, Precision Coated Polishing Paper, Precision Coated Polishing Tape

Type:
lapping powder

Material:
Silica, Carborundum, Silicon Carbide Crystal